Display Module Assembly

SiPix offers assembly services for electronic paper display modules. The following illustrations provide a brief overview of the e-paper integration process, which is similar for both direct drive and active matrix displays:

Procedural Step	Comments
	Individual panels are cut from a Microcup® e-Paper roll.
	Kiss cutting equipment is used to shear the Microcup® sealing layer. The remaining material is stripped to expose the transparent conductor. This will later be connected to the ground electrode on the backplane upon lamination.
	The film is inverted and laminated to the backplane.
	The edge of the film is sealed. The driver IC is then either attached directly on the backplane or bonded to interconnect.
	The e-paper module is completed.